Precision Ceramic Parts of Semiconductor Process Equipment
Large-Scale Chamber Shields & Precision Ceramic Handling Components. Touch-Down boasts a group of excellent engineers and enjoys a unique high-profile technology in the special-shaped ceramic processing projects. Special-shaped processing technology is the strengths of Touch-Down.
Touch-Down produced precision ceramic parts feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization. For many years, it has been used by the semiconductor manufacturing plant.
This demonstrates our exceptional CNC capabilities in executing complex geometric cuts and maintaining tight tolerances on large, ultra-hard ceramic bodies. Applications:Plasma Dry Etching systems, CVD/PVD chamber internal shielding, High-temperature diffusion furnaces, and 300mm automated wafer handling systems.
Processing Object
Capability to produce large-format ceramic components ranging from 250mm to 550mm, fully supporting 300mm (12-inch) wafer processing and advanced packaging tools.
Type
Ceramic ring ceramic parts.
Main Features
Touch-Down produced precision ceramic parts feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization.
The Main Products
Ceramic Bolt, Ceramic Shaft, Zirconia Ceramic, Plug Gauge, Ring Gauge, Alumina Ceramic Arm, Ceramic Disc, Ceramic Ring, Microporous Ceramic Vacuum Chuck, Substrate, Ceramic, Ceramic Rails, Special-Shaped Pieces and so on.
- Gallery
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Comprehensive Precision Ceramics - Large-Scale Rings & Customized Semiconductor Components. 300mm (12-inch) Advanced Process Chamber Rings, Ion Implantation Systems, CVD/PVD Thin-film Deposition, and High-dynamic Wafer Handling Modules.
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Ceramic-Quartz Hybrid Precision End Effector (Wafer Handling Blade) Optical metrology handling, precision pick-and-place in vacuum environments, CVD front-end modules, and advanced processes sensitive to particle contamination.
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Precision Ceramic Clamp Ring / Flange for Semiconductor Vacuum Systems. High-purity alumina ceramic clamping ring featuring a three-point lug design and precision-stepped inner diameter for chamber component securing.
- Precision Ceramic Ring / Retaining Ring for Semiconductor Processing Chambers. High-purity precision ceramic retaining ring with metal mounting inserts and alignment cutouts for semiconductor etch or deposition equipment.
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- High-Precision Ceramic Gas Distribution Plate for Semiconductor Processing. High-purity alumina ceramic disk with radial gas grooves and precision mounting holes for PVD/CVD chamber gas distribution.
- Large precision ceramic isolator ring and slotted ceramic disc for advanced semiconductor processing chambers, available in sizes from 250mm to 550mm.
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Semiconductor equipment --- large-scale precision ceramic parts (250mm - 550mm)
- Related Products
Ceramic Arm for Wafer Drive of Semiconductors
Touch-Down produced Ceramic arm for wafer drive of semiconductor feature good structural strength,...
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Precision Ceramics
Touch-Down - Most accurate and professional long-term partner. Welcome to trial and proofing.
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Precision Ceramic Parts of Semiconductor Process Equipment | Over 30 Years Advanced Ceramic Parts & Components Manufacturer | Touch-Down Technology Co., Ltd
Based in Taiwan since 1997, Touch-Down has been a fine ceramic parts and components manufacturer. Their main ceremic products, including Precision Ceramic Parts of Semiconductor Process Equipment, fine ceramics, advanced ceramics and special ceramics integrating production, which are ISO 9001 certified.
Touch-Down is a compact, high-precision ceramic part manufacturer, who is specialized in the manufacture of fine ceramics / advanced ceramics / special ceramics integrating production and sales from raw material preparation, molding, plane grinding, abrasive machining of inner and outer diameters to digital processing of NC drilling crew. Over the past two decades, it has provided products and services for parts manufacturing and processing of fine ceramics, aluminium oxide, zirconium oxide, quartz and silicon carbide in terms of semiconductor processing, LED processing, TFT / LCD processing, solar chip processing, machinery production, medical and pharmaceutical industry and national defense and military.
Touch-Down has been selling advanced ceramics to US, Europe and Australia for over two decades since 1997, both with advanced technology and 30 years of experience, Touch-Down ensures each customer's demands are met.


