Ceramic Arm for Wafer Drive | Touch-Down Semiconductor Parts

Ceramic Arm for Wafer Drive of Semiconductors

Touch-Down produced Ceramic arm for wafer drive of semiconductor feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization. For many years, it has been used by the semiconductor manufacturing plant.

Touch-Down boasts a group of excellent engineers and enjoys a unique high-profile technology in the special-shaped ceramic processing projects. Special-shaped processing technology is the strengths of Touch-Down.

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Located near the Science Park of Taiwan Hsinchu, the world-renowned science and technology town, our plant enjoys more than 25 years of professional production and processing experience in alumina, zirconia, silicon nitride, silicon carbide ceramic production and processing. We boast strong technical force, refined equipment and rich processing experience. Now we have several precision CNC equipment, precision machine tools, and a variety of leading processing technology and processing tools as well as sophisticated detection equipment to ensure product quality and precision. We are able to produce precision ceramic parts of a variety of specifications, types according to customer drawings. Our products feature high precision, good performance and are widely used in semiconductor, photovoltaic, precision machinery, military, medical, scientific research and other field.

Touch-Down is a professional manufacturer of semiconductor equipment components. Our main products include End Effectors, Wafer Blades, Robot Forks, Ceramic Arms, and Wafer Handling Components. Compatible with equipment from Applied Materials, Lam Research, TEL, Hitachi, and other leading international manufacturers. We offer OEM services and custom solutions with reliable lead times and consistent quality. Inquiries with drawings or samples are welcome.

Ceramic Cutting / Grinding Disc (For Semiconductor)

This image shows a set of precision ceramic wafer handling forks used in semiconductor fabrication equipment. These components function as wafer transfer end effectors in automated wafer handling systems, supporting safe movement and positioning of silicon wafers throughout the manufacturing process.

Manufactured from high-purity technical ceramics, these wafer forks provide:

Low particle generation for cleanroom compatibility

High thermal stability for process environments

Excellent mechanical rigidity for precise wafer support

Chemical resistance for semiconductor fabrication conditions

Different fork geometries are designed to support various wafer diameters (150mm / 200mm / 300mm) and equipment architectures, including wafer transfer robots, wafer aligners, wafer inspection systems, and process tool loading modules.

These ceramic components are widely used in semiconductor fabs, wafer handling automation platforms, and front-end wafer processing equipment.

Main Features

Touch-Down produced precision ceramic parts feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization.

The Main Products

Ceramic Bolt, Ceramic Shaft, Zirconia Ceramic, Plug Gauge, Ring Gauge, Alumina Ceramic Arm, Ceramic Disc, Ceramic Ring, Microporous Ceramic Vacuum Chuck, Substrate, Ceramic, Ceramic Rails, Special-Shaped Pieces and so on.

Gallery

Ceramic wafer ring、Wafer handling ring、Semiconductor wafer transfer arm、Wafer handling robot component、Semiconductor ceramic parts
Ceramic arm for wafer drive of semiconductors
Ceramic arm for wafer drive of semiconductors
Product Title: Multi-Zone Precision Ceramic Heater for Semiconductor Processing
Ceramic arm for wafer drive of semiconductors
High-Precision Ceramic End Effector (Robot Blade) for Semiconductor Handling. 「Wafer Handling」、「Robot Blade」、「Ceramic Arm」
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Ceramic arm for wafer drive of semiconductors
Ceramic arm for wafer drive of semiconductors
Multi-Series Precision Ceramic Vacuum Chucks & End Effector Assemblies. Applications,Wafer inspection systems, Wafer bonding, Back-end assembly and testing (OSAT), and surface analysis instrumentation.
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Ceramic arm for wafer drive of semiconductors
Precision Ceramic Heating & Vacuum Handling Components. Applications: Chemical Vapor Deposition (CVD/ALD), Plasma Etching, Equipment Front End Modules (EFEM), and high-temperature wafer probing.
High-Precision Ceramic Robot Blade with Integrated Vacuum Channels. Applications,300mm wafer handling systems, Automated Optical Inspection (AOI), Metrology/Thin-film measurement tools, and High-Vacuum transfer modules.
Comprehensive Collection of Semiconductor-Grade Ceramic Robot Blades & Vacuum Chucks. Applications"Equipment Front End Modules (EFEM), High-vacuum chamber transfer, Wafer inspection/metrology, and OSAT automated testing lines."
Ceramic arm for wafer drive of semiconductors

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