Ceramic Arm for Wafer Drive of Semiconductors
Touch-Down produced Ceramic arm for wafer drive of semiconductor feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization. For many years, it has been used by the semiconductor manufacturing plant.
Touch-Down boasts a group of excellent engineers and enjoys a unique high-profile technology in the special-shaped ceramic processing projects. Special-shaped processing technology is the strengths of Touch-Down.
Located near the Science Park of Taiwan Hsinchu, the world-renowned science and technology town, our plant enjoys more than 25 years of professional production and processing experience in alumina, zirconia, silicon nitride, silicon carbide ceramic production and processing. We boast strong technical force, refined equipment and rich processing experience. Now we have several precision CNC equipment, precision machine tools, and a variety of leading processing technology and processing tools as well as sophisticated detection equipment to ensure product quality and precision. We are able to produce precision ceramic parts of a variety of specifications, types according to customer drawings. Our products feature high precision, good performance and are widely used in semiconductor, photovoltaic, precision machinery, military, medical, scientific research and other field.
Ceramic Cutting / Grinding Disc (For Semiconductor)
This image shows a set of precision ceramic wafer handling forks used in semiconductor fabrication equipment. These components function as wafer transfer end effectors in automated wafer handling systems, supporting safe movement and positioning of silicon wafers throughout the manufacturing process.
Manufactured from high-purity technical ceramics, these wafer forks provide:
Low particle generation for cleanroom compatibility
High thermal stability for process environments
Excellent mechanical rigidity for precise wafer support
Chemical resistance for semiconductor fabrication conditions
Different fork geometries are designed to support various wafer diameters (150mm / 200mm / 300mm) and equipment architectures, including wafer transfer robots, wafer aligners, wafer inspection systems, and process tool loading modules.
These ceramic components are widely used in semiconductor fabs, wafer handling automation platforms, and front-end wafer processing equipment.
Main Features
Touch-Down produced precision ceramic parts feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization.
The Main Products
Ceramic Bolt, Ceramic Shaft, Zirconia Ceramic, Plug Gauge, Ring Gauge, Alumina Ceramic Arm, Ceramic Disc, Ceramic Ring, Microporous Ceramic Vacuum Chuck, Substrate, Ceramic, Ceramic Rails, Special-Shaped Pieces and so on.
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- Ceramic wafer ring
- Ceramic arm for wafer drive of semiconductors
- Ceramic arm for wafer drive of semiconductors
- Product Title: Multi-Zone Precision Ceramic Heater for Semiconductor Processing
- Ceramic arm for wafer drive of semiconductors
- High-Precision Ceramic End Effector (Robot Blade) for Semiconductor Handling. 「Wafer Handling」、「Robot Blade」、「Ceramic Arm」
- High-Precision U-Shaped Ceramic End Effector (Robot Blade). Ideal for EFEM (Equipment Front End Modules), ALD, CMP, and Dry Etching automation systems.
- Comprehensive Precision Ceramic Robot Blades & Handling Components. Applications:
- Precision Ceramic Vacuum Blade with Integrated Micro-Channels. Applications:
- High-Performance Ceramic Robot Blade for Semiconductor Packaging & Testing. Semiconductor packaging equipment, Wafer sorting & testing systems, and high-temperature baking process handling.
- Ceramic arm for wafer drive of semiconductors
- Ceramic arm for wafer drive of semiconductors
- Multi-Series Precision Ceramic Vacuum Chucks & End Effector Assemblies. Applications:
- Comprehensive Series of Precision Ceramic End Effectors (Robot Blades). Applications:
- Ceramic arm for wafer drive of semiconductors
- Precision Ceramic Heating & Vacuum Handling Components. Applications: Chemical Vapor Deposition (CVD/ALD), Plasma Etching, Equipment Front End Modules (EFEM), and high-temperature wafer probing.
- High-Precision Ceramic Robot Blade with Integrated Vacuum Channels. Applications:
- Comprehensive Collection of Semiconductor-Grade Ceramic Robot Blades & Vacuum Chucks. Applications:
- Ceramic arm for wafer drive of semiconductors
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Precision Ceramics
Touch-Down - Most accurate and professional long-term partner. Welcome to trial and proofing.
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Ceramic Arm for Wafer Drive of Semiconductors | Over 30 Years Advanced Ceramic Parts & Components Manufacturer | Touch-Down Technology Co., Ltd
Based in Taiwan since 1997, Touch-Down has been a fine ceramic parts and components manufacturer. Their main ceremic products, including Ceramic Arm for Wafer Drive of Semiconductors, fine ceramics, advanced ceramics and special ceramics integrating production, which are ISO 9001 certified.
Touch-Down is a compact, high-precision ceramic part manufacturer, who is specialized in the manufacture of fine ceramics / advanced ceramics / special ceramics integrating production and sales from raw material preparation, molding, plane grinding, abrasive machining of inner and outer diameters to digital processing of NC drilling crew. Over the past two decades, it has provided products and services for parts manufacturing and processing of fine ceramics, aluminium oxide, zirconium oxide, quartz and silicon carbide in terms of semiconductor processing, LED processing, TFT / LCD processing, solar chip processing, machinery production, medical and pharmaceutical industry and national defense and military.
Touch-Down has been selling advanced ceramics to US, Europe and Australia for over two decades since 1997, both with advanced technology and 30 years of experience, Touch-Down ensures each customer's demands are met.


