Precision Porous Ceramic Vacuum Chuck Solutions for Advanced Manufacturing

High-density porous ceramic vacuum chuck components engineered for semiconductor, panel processing, and precision machining with exceptional holding accuracy and thermal stability.

Porous Ceramic Chuck Table, Precise Porous Ceramic Partial Vacuum Chuck - Porous Ceramic - Vacuum Chuck Components Production
  • Porous Ceramic Chuck Table, Precise Porous Ceramic Partial Vacuum Chuck - Porous Ceramic - Vacuum Chuck Components Production
  • Porous Ceramic - Vacuum Chuck Components Production
  • Porous Ceramic - Vacuum Chuck Components Production
  • Porous Ceramic - Vacuum Chuck Components Production

Porous Ceramic Chuck Table, Precise Porous Ceramic Partial Vacuum Chuck

High-density ceramic vacuum chuck (porous ceramic vacuum chuck) features the special porous ceramic material pore size of 2 to 3 microns, which is difficult to block with large vacuum force and part area adsorption. It can also serve as air flotation platform, widely used in semiconductor, panel, laser process and non-contact linear slide. Porous ceramic vacuum chuck maintains transmission through hermetically sealed air. The device application is limited to work platforms for flat, non-porous surfaces. The user is usually a machine operator. In the field of metalworking, this is a safe and reliable transfer of workpiece.

The worktable of automated transfer, object drawing, positioning, precision screen printing leverages on the porous permeable ceramic (alumina or silicon carbide) connected to the vacuum suction to place the workpiece (including wafer, glass, PET film or other thin objects) on the ceramic chuck and use vacuum suction to fix the work piece for cleaning, cutting, grinding, screen printing and other processing procedures.

Ceramic Cutting / Grinding Disc (For Semiconductor)

Wafer clamping system not only includes the role of wafer processing in the process of movement, but also puts working load required for processing on the wafer and ensures that the wafer under the action of the load will not be subject to warping deformation. Therefore, the performance of the wafer clamping system is of great importance to improving the quality of the final wafer product. In response to this demand, the most widely used method in the wafer clamping system at present is to use the vacuum negative pressure to "suck" the "vacuum chuck" of the workpiece, which has the advantages of high efficiency, no pollution, high positioning accuracy and high-hardness abrasion performance and low coefficient of thermal expansion.

Processing Object

Ceramic Vacuum Chuck (Porous Ceramic Vacuum Chuck).

Type

Alumina Ceramic Chuck.

Main Features

Touch-Down boasts a group of excellent engineers and enjoys a unique high-profile technology in the special-shaped ceramic processing projects. Special-shaped processing technology is the strengths of Touch-Down.

Touch-Down produced precision ceramic parts feature good structural strength, high temperature resistance, high pressure resistance, good accuracy, good parallelism, high density and uniform organization. For many years, it has been used by the semiconductor manufacturing plant.

Located near the Science Park of Taiwan Hsinchu, the world-renowned science and technology town, our plant enjoys more than 25 years of professional production and processing experience in alumina, zirconia, silicon nitride, silicon carbide ceramic production and processing. We boast strong technical force, refined equipment and rich processing experience. Now we have several precision CNC equipment, precision machine tools, and a variety of leading processing technology and processing tools as well as sophisticated detection equipment to ensure product quality and precision. We are able to produce precision ceramic parts of a variety of specifications, types according to customer drawings. Our products feature high precision, good performance and are widely used in semiconductor, photovoltaic, precision machinery, military, medical, scientific research and other field.

The Main Products

Ceramic Bolt, Ceramic Shaft, Zirconia Ceramic, Plug Gauge, Ring Gauge, Alumina Ceramic Arm, Ceramic Disc, Ceramic Ring, Microporous Ceramic Vacuum Chuck, Substrate, Ceramic, Ceramic Rails, Special-Shaped Pieces and so on.

Specification

Product Name: Porous Ceramic Vacuum Chuck
Dimensions: 200mm - 500mm x 30mm
Attributes:
Main Components: Alumina
Color: Black / Brown
Alumina Content: 92%
Moisture Content: 0%
Pore Size: 2 ~ 3um
Porosity: 35 ~ 40%
Flexural Strength: 6 kgf / cm² (Mpa)
Volume Ratio: 2.28 g / cm³

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More Details

How can you ensure zero wafer deformation during high-precision semiconductor processing with superior clamping performance?

Touch-Down's porous ceramic vacuum chuck delivers precision wafer clamping with 2-3 micron pore size and 92% alumina composition, preventing workpiece warping under processing loads while maintaining hermetically sealed air transmission. Our ceramic chuck technology has been trusted by semiconductor manufacturing plants for over 25 years, providing the exact holding force distribution and thermal stability required for advanced wafer processing. Request a technical specification sheet to learn how our customized ceramic vacuum chuck solutions can enhance your equipment's performance and precision.

Touch-Down delivers customized porous ceramic vacuum chuck solutions engineered to your exact specifications, backed by rigorous quality control and ISO 9001:2008 certification. Our precision ceramic chuck technology eliminates workpiece warping during cleaning, cutting, grinding, and screen printing operations while maintaining the high positioning accuracy and low thermal expansion essential for advanced semiconductor manufacturing. With sophisticated detection equipment and specialized processing capabilities honed over 25 years near Taiwan's Hsinchu Science Park, we ensure every ceramic chuck table meets Japanese quality standards and delivers superior performance in automated transfer systems, precision machinery applications, and non-contact linear slide platforms. Contact our engineering team today to discuss custom ceramic vacuum chuck components engineered for your specific processing requirements.